Presentations

VIDEO PRESENTATIONS

Invited presentations:

Topology optimisation of fluid-thermal systems:
heat sinks and heat exchangers


J Alexandersen

Invited presentation at the InDEStruct project workshop on "Additive Manufacturing, Vibrations, Optimisation." on the 15th-17th of September 2021. Pre-recorded version available on YouTube:


Topology optimisation for electronics cooling


J Alexandersen

Invited presentation at the DANSIS Seminar 'Cooling of electronics' on the 7th of October 2020.

Extended version available on YouTube:


Topology optimization of heat sinks for instantaneous chip cooling using a transient pseudo-3D thermofluid model


T Zeng, H Wang, M Yang, J Alexandersen

Invited presentation at the 4th TOP Webinar available only on their Youtube channel.

International Journal of Heat and Mass Transfer (2020) 154:119681

doi:10.1016/j.ijheatmasstransfer.2020.119681

Preprint: arxiv:1911.12987

Postprint: local


Conference presentations:


Topography optimisation for parallel plate heat exchangers


J Alexandersen

Conference presentation at the 14th World Congress of Structural and Multidisciplinary Optimization (WCSMO14) June 2021.



Revisiting the optimal thickness profile of coolings fins: optimality conditions and branching


J Alexandersen, O Sigmund

Conference presentation at the 2021 Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 

Preprint:arxiv:2012.04310 - Postprint: local



Application of full and approximate flow models in topology optimisation of passive cooling for electronics cabinets


J Alexandersen

Conference presentation at the 2020 Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 

Postprint: local



Geometric exploration and optimisation of porous ceramic reactors for bioethanol production


J Gerard, J Alexandersen

Conference presentation at the 2020 COMSOL Europe conference - view on the COMSOL website



Heat sink topology optimisation using a transient pseudo-3D thermofluid model for instantaneous chip cooling


T Zeng, H Wang, M Yang, J Alexandersen

Conference presentation at the 14th WCCM & ECCOMAS Congress 2020 - view on SlidesLive